愛博斯迪科2035SC替代品，代替品ablestik2035
one component epoxy adhesive,
which has high shear strength with image sensor die
during high temperature bonding process such as hotbar
or ACF bonding. It is designed to have high T.I and
viscosity to prevent die rotation or tilt problem.
Typical Application
Die Attach Adhesive
Property of Material
Color Pink
Specific Gravity 1.44
Viscosity (Brookfield C&P HBDV-II,
Spindle #51, 25°C)
5 RPM 38,000 cps
Thixotropic Index 4.7
Work Life @ 25°C, days 3
Shelf Life @ -15°C, months 6
Physical Properties
Gel Time @ 100°C, Hot plate 1M 15S
Hardness (Shore D) 86
Glass Transition Temperature (Tg) 54°C
Coefficient of Thermal Expansion
Below Tg 57 ppm/°C
Above Tg 153 ppm/°C
Die Shear Adhesion
Si die (3mm x 3mm) to FR4 PCB
@ 25°C 37 kgf
@ 230°C 3.2 kgf
熱線：1-3-5-1-0-2-4-6-2-9-8
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