愛博斯迪科2035SC替代品，代替品ablestik2035 one component epoxy adhesive, which has high shear strength with image sensor die during high temperature bonding process such as hotbar  or ACF bonding. It is designed to have high T.I and viscosity to prevent die rotation or tilt problem. Typical Application Die Attach Adhesive Property of Material Color Pink Specific Gravity 1.44 Viscosity (Brookfield C&P HBDV-II, Spindle #51, 25°C) 5 RPM 38,000 cps Thixotropic Index 4.7 Work Life @ 25°C, days 3 Shelf Life @ -15°C, months 6 Physical Properties Gel Time @ 100°C, Hot plate 1M 15S Hardness (Shore D) 86 Glass Transition Temperature (Tg) 54°C Coefficient of Thermal Expansion Below Tg 57 ppm/°C Above Tg 153 ppm/°C Die Shear Adhesion Si die (3mm x 3mm) to FR4 PCB @ 25°C 37 kgf @ 230°C 3.2 kgf 熱線：1-3-5-1-0-2-4-6-2-9-8